Institute of Future Technology and Design (IFTD) Forum and Workshops

KUALA LUMPUR – August 7, 2025 – We are honoured to invite you to participate in the inaugural Institute of Future Technology and Design (IFTD) Forum and Workshops, a groundbreaking collaboration between HELP University and China's top-ranked packaging institution, Hunan University of Technology (HUT). This pioneering initiative represents a strategic alliance to advance innovation, sustainability, and human-centric development in the circular economy.

About the IFTD Partnership

In 2025, HUT and HELP University are launching the Institute of Future Technology and Design (IFTD) at HELP University—establishing Southeast Asia's premier hub for sustainable packaging R&D and talent cultivation. This collaboration unites China's #1 packaging technology institution with Malaysia's innovative educational leader to address one of our era's most critical challenges: rethinking packaging and design for ecological resilience, technological progress, and inclusive growth.

Forum Themes and Focus Areas

Our Forum and Workshops will explore seven key themes that merge ecology, technology, and creativity to replace linear waste with circular regeneration. The sessions will cover a range of topics, from Sustainable Materials & Eco-Design, focusing on bio-based and recyclable innovations, to Smart Packaging that utilises technologies like QR/RFID, sensors and supply-chain transparency. We'll also explore Circular Design, assessing product lifecycle assessment and regenerative systems; AI & Green Manufacturing, which focuses on automation, digital twins and low-energy production; and Consumer Engagement, exploring branding, ethics, and sustainable behaviour. Additionally, the discussions will address Policy & Governance, including EPR, and public-private models, and Talent Development, focusing on the future-ready, cross-disciplinary training.

Strategic Objectives and Regional Impact

The forum aims to drive transformation across four critical areas, such as Talent Development by equipping the next generation of sustainability leaders, and on Business Transformation by converting circular packaging into competitive advantage. The event will also explore Technology Adoption, which will look into scaling AI, IoT, and automation for eco-innovation, and finally, it will also address Ecological Repair, concentrating on designing systems that restore nature.

Our vision extends beyond national boundaries. Malaysia and ASEAN, positioned at the nexus of China's industry and regional dynamism, can lead Asia's green transformation in alignment with national and regional sustainability goals. This Forum represents Malaysia's opportunity to play a central role in the ecology of technology design and packaging.

Partnership Opportunities

The IFTD Partnership offers unprecedented collaboration opportunities in co-developing courses in packaging innovation and sustainability, Credit transfer, degree collaboration, exchanges, and joint laboratories, a China-Malaysia innovation corridor for R&D and startups as well as training and study visits to China's AI institutions and technology hubs.

Your Participation Matters

As a leader in the design technology and packaging industry, your expertise and perspective are invaluable to achieving our shared vision. The Forum provides an exceptional platform to connect globally with academia, industry, and government leaders across borders. It also serves as an opportunity to showcase innovation by presenting cutting-edge research in design, packaging, and sustainability. It also provides a platform to build partnerships by developing strategic alliances for circular economy solutions, access to talents with connections to the next generation of sustainability professionals, and lastly, the opportunity to influence policy to shape the future of sustainable packaging standards and practices.

Leadership and Vision

Under the visionary leadership of  Hunan University of Technology and HELP University , this initiative represents more than a forum—it seeds a future where packaging regenerates, technology serves ecology, and collaboration builds a humane, sustainable world.

Event Details

Forum: The Application of AI in the Design Industry

Date: August 23, 2025

Time: 9:00 AM - 1:00 PM

Venue: Level 4, Auditorium, Wisma CL, Kuala Lumpur

Speaker: Prof. Heping Zhu, Dean of the College of Packaging Design and Art at Hunan University of Technology

Fees: RM200 (+8% SST) = RM216

Workshop 1: AI Applications to Improve Productivity and Profitability (2 Days)

Date: August 25-26, 2025

Time: 9:30 AM - 5:30 PM

Venue: Level 9, HELP University, ELM Business School, Kuala Lumpur

Fees: RM2,500 (+8% SST) = RM2,700

EARLY BIRD (register before August 15, 2025): 50% discount

Workshop 2: Use of Technology for Sustainable Packaging (3 Days)

Date: August 25-27, 2025

Time: 9:30 AM - 5:30 PM

Venue: Level 9, HELP University, ELM Business School, Kuala Lumpur

Fees: RM5,500 (+8% SST) = RM5,940

EARLY BIRD (register before August 15, 2025): 50% discount

Exhibition: Award-Winning Concepts in Eco-Design, Smart Packaging and Circular Innovation (From HUT's School of Packaging Design & Art)

Date: August 23-27, 2025

Time: 9:30 AM - 5:30 PM

Venue: Level 4, Wisma CL, Kuala Lumpur

Fees: Free of Charge

Special Offer: Participants who register for either Workshop 1 or Workshop 2 are entitled to attend the Forum free of charge.

Take advantage of our Early Bird offer—register before August 15, 2025, and save 50% on all paid events!

For registration and inquiries:

Dr. Fiona: 017-306 6300

Dr. Alice Lim: 012-332 0179

Ms. Liz Quah: 012-267 2378